110 V dc, 250V ac Auxiliary Release Shunt trip for use with FAZ Series MCB/RCBO

RS Stok Numarası: 922-6958Marka: EatonÜretici Parça Numarası: 262414 FAZ-XAM002IMPA: 0
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Özellikler

Maximum Switching Power DC

0.90 W

Manufacturer Part No.

1SVR011700R0000 - CAIS E UNI 24V D

Çıkış Gerilimi Ayar Aralığı

±22.8 V dc, ±25.2 V dc

Uyumlu Boru Boyutu

4in

Marka

Eaton

Ürün Ayrıntıları

Heat Sink 177AB Series, 300mm Wide x 83mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

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P.O.A.

110 V dc, 250V ac Auxiliary Release Shunt trip for use with FAZ Series MCB/RCBO

1

Katlarında sipariş edilebilir 1
1P.O.A.
2P.O.A.
3P.O.A.
4P.O.A.
5P.O.A.
6P.O.A.
7P.O.A.
8P.O.A.
9P.O.A.
10P.O.A.
11P.O.A.
12P.O.A.
13P.O.A.
14P.O.A.
15P.O.A.

P.O.A.

110 V dc, 250V ac Auxiliary Release Shunt trip for use with FAZ Series MCB/RCBO
Stok bilgileri geçici olarak kullanılamıyor.

1

Katlarında sipariş edilebilir 1
1P.O.A.
2P.O.A.
3P.O.A.
4P.O.A.
5P.O.A.
6P.O.A.
7P.O.A.
8P.O.A.
9P.O.A.
10P.O.A.
11P.O.A.
12P.O.A.
13P.O.A.
14P.O.A.
15P.O.A.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Teknik Belgeler

Özellikler

Maximum Switching Power DC

0.90 W

Manufacturer Part No.

1SVR011700R0000 - CAIS E UNI 24V D

Çıkış Gerilimi Ayar Aralığı

±22.8 V dc, ±25.2 V dc

Uyumlu Boru Boyutu

4in

Marka

Eaton

Ürün Ayrıntıları

Heat Sink 177AB Series, 300mm Wide x 83mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more