Teknik Belgeler
Özellikler
Marka
TE ConnectivityKontakların Sayısı
40
Sıraların Sayısı
2
Hatve
1.27mm
Tip
Şerit Soketler
Montaj Tipi
Yüzeye Monte
Gövde Yönü
Düz
Sonlandırma Yöntemi
Lehim
Akım Değeri
12A
Gerilim Değeri
30.0 V
Seri
AMPMODU System 50
Kontak Malzemesi
Bakır
Menşe
United States
Ürün Ayrıntıları
TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Grid Board to Board Vertical Receptacles
AMPMODU 50/50 1.27mm x 1.27mm grid board to board vertical receptacles for SMT parallel board to board stacking in high density .050 x .050 applications. Parallel board to board stack heights of 6.35mm, 8.13mm and 9.91mm can by achieved using the same receptacle and selecting the appropriate header (board to board .050 x.050 double row vertical and right angle headers). These AMPMODU 50/50 1.27mm x 1.27mm vertical SMT board to board receptacle connectors have UL 94V-0 black glass filled thermoplastic housings, PCB hold down posts, polarizing tabs, gold plated contacts and are compatible with IR (infrared) and VPR(vapour phase reflow) surface mount processes.
Approvals
UL 94V-0
TE Connectivity AMPMODU 50/50 1.27mm Connectors
The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.
Stok bilgileri geçici olarak kullanılamıyor.
Ayrıntılı bilgi için iletşime geçiniz
237,661 TL
Each (In a Tube of 17) KDV Hariç
285,193 TL
Each (In a Tube of 17) KDV Dahil
17
237,661 TL
Each (In a Tube of 17) KDV Hariç
285,193 TL
Each (In a Tube of 17) KDV Dahil
17
Teknik Belgeler
Özellikler
Marka
TE ConnectivityKontakların Sayısı
40
Sıraların Sayısı
2
Hatve
1.27mm
Tip
Şerit Soketler
Montaj Tipi
Yüzeye Monte
Gövde Yönü
Düz
Sonlandırma Yöntemi
Lehim
Akım Değeri
12A
Gerilim Değeri
30.0 V
Seri
AMPMODU System 50
Kontak Malzemesi
Bakır
Menşe
United States
Ürün Ayrıntıları
TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Grid Board to Board Vertical Receptacles
AMPMODU 50/50 1.27mm x 1.27mm grid board to board vertical receptacles for SMT parallel board to board stacking in high density .050 x .050 applications. Parallel board to board stack heights of 6.35mm, 8.13mm and 9.91mm can by achieved using the same receptacle and selecting the appropriate header (board to board .050 x.050 double row vertical and right angle headers). These AMPMODU 50/50 1.27mm x 1.27mm vertical SMT board to board receptacle connectors have UL 94V-0 black glass filled thermoplastic housings, PCB hold down posts, polarizing tabs, gold plated contacts and are compatible with IR (infrared) and VPR(vapour phase reflow) surface mount processes.
Approvals
UL 94V-0
TE Connectivity AMPMODU 50/50 1.27mm Connectors
The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.