Teknik Belgeler
Özellikler
Marka
BergquistKalınlık
0.001inç
Termal İletkenlik
1.5W/m·K
Malzeme
Hi-Flow 650P
Kendinden Yapışkanlı
Yes
Minimum Çalışma Sıcaklığı
-40°C
Maksimum Çalışma Sıcaklığı
+150°C
Malzeme Ticari Adı
Hi-Flow 650P
Çalışma Sıcaklığı Aralığı
-40 → +150°C
Menşe
United States
Ürün Ayrıntıları
Hi-Flow 650P
Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.
Stok bilgileri geçici olarak kullanılamıyor.
Ayrıntılı bilgi için iletşime geçiniz
96,451 TL
Each (In a Bag of 50) KDV Hariç
115,741 TL
Each (In a Bag of 50) KDV Dahil
50
96,451 TL
Each (In a Bag of 50) KDV Hariç
115,741 TL
Each (In a Bag of 50) KDV Dahil
50
Teknik Belgeler
Özellikler
Marka
BergquistKalınlık
0.001inç
Termal İletkenlik
1.5W/m·K
Malzeme
Hi-Flow 650P
Kendinden Yapışkanlı
Yes
Minimum Çalışma Sıcaklığı
-40°C
Maksimum Çalışma Sıcaklığı
+150°C
Malzeme Ticari Adı
Hi-Flow 650P
Çalışma Sıcaklığı Aralığı
-40 → +150°C
Menşe
United States
Ürün Ayrıntıları
Hi-Flow 650P
Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.