Heatsink Soğutucu, 0,18K/W
Teknik Belgeler
Özellikler
Marka
Fischer ElektronikÜrün Tipi
Soğutucu Eleman
Şununla Birlikte Kullanım İçin
Universal Rectangular Alu with Fan
Uzunluk
150mm
Genişlik
80 mm
Yükseklik
83mm
Bitirme
Siyah Anotlanmış
Standartlar/Onaylar
No
Uygulama
Cooling
Malzeme
Alüminyum
Special Features
Technical Introduction, Maximum Heat Flow Due to Brazing or Thermal Adhesion, Two Opposite Mounting Surfaces Are Milled Flat, Geometry of Hollow Fin Optimizing the Air Flow, Cooling Aggreg in Segment Mount, Additional Treatment Upon Customer's Request, Particularly Effective Heat Dissipation, High Performance Density Due to Large Heatconducting Surfaces, Standard Aluminium Profiles, Special Heatsink Design, Miniature Cooling Aggregates, Compact Construction, Mounting Pads, Protection Grid for Axial Fans, With Air Flow Chamber, Silicone Wafers, Extremely Low Losses Due to Optimised Hollow Fin Geometry, Thermal Conductive Silicone Foam Foil, Heatsinks With Hollow Fin Profile, Cooling Aggregates With Radial Fan, High Performance Cooling Aggregates, Semiconductor Mounting Surface for Milled Flat, Heatsinks for Solid State Relay, Hole Pattern, Cooling Aggregates With Axial Fan
Menşe
Hungary
Ürün Ayrıntıları
Fischer Elektronik Cooling Aggregates with Axial Fans
Fischer Elektronik cooling aggregates with fitted axial fans offer a versatile and efficient cooling solution in high powered applications where heat dissipation is only possible by forced convection. With a range of sizes to suit an array of requirements, Fischer Elektronik cooling aggregates are ideal.
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Teklif İsteyiniz
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Teklif İsteyiniz
Stok bilgileri geçici olarak kullanılamıyor.
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Teknik Belgeler
Özellikler
Marka
Fischer ElektronikÜrün Tipi
Soğutucu Eleman
Şununla Birlikte Kullanım İçin
Universal Rectangular Alu with Fan
Uzunluk
150mm
Genişlik
80 mm
Yükseklik
83mm
Bitirme
Siyah Anotlanmış
Standartlar/Onaylar
No
Uygulama
Cooling
Malzeme
Alüminyum
Special Features
Technical Introduction, Maximum Heat Flow Due to Brazing or Thermal Adhesion, Two Opposite Mounting Surfaces Are Milled Flat, Geometry of Hollow Fin Optimizing the Air Flow, Cooling Aggreg in Segment Mount, Additional Treatment Upon Customer's Request, Particularly Effective Heat Dissipation, High Performance Density Due to Large Heatconducting Surfaces, Standard Aluminium Profiles, Special Heatsink Design, Miniature Cooling Aggregates, Compact Construction, Mounting Pads, Protection Grid for Axial Fans, With Air Flow Chamber, Silicone Wafers, Extremely Low Losses Due to Optimised Hollow Fin Geometry, Thermal Conductive Silicone Foam Foil, Heatsinks With Hollow Fin Profile, Cooling Aggregates With Radial Fan, High Performance Cooling Aggregates, Semiconductor Mounting Surface for Milled Flat, Heatsinks for Solid State Relay, Hole Pattern, Cooling Aggregates With Axial Fan
Menşe
Hungary
Ürün Ayrıntıları
Fischer Elektronik Cooling Aggregates with Axial Fans
Fischer Elektronik cooling aggregates with fitted axial fans offer a versatile and efficient cooling solution in high powered applications where heat dissipation is only possible by forced convection. With a range of sizes to suit an array of requirements, Fischer Elektronik cooling aggregates are ideal.