Molex Micro-Fit 3.0 Series Vertical Through Hole PCB Header, 4 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded

RS Stok Numarası: 670-0368PMarka: MolexÜretici Parça Numarası: 43045-0427
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Teknik Belgeler

Özellikler

Marka

Molex

Seri

Micro-Fit 3.0

Hatve

3.0mm

Kontakların Sayısı

4

Sıraların Sayısı

2

Gövde Yönü

Dikey

Örtülü/Örtüsüz

Örtülü

Montaj Tipi

Açık Delik

Konnektör Sistemi

Kablo - PCB

Sonlandırma Yöntemi

Açık Delikli

Kontak Malzemesi

Pirinç

Kontak Kaplaması

Kalay

Akım Değeri

8.5A

Seri Numarası

43045

Gerilim Değeri

600 V

Ürün Ayrıntıları

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with PCB Polarizing Peg, 43045 Series

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

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6.426,40 TL

64,264 TL Each (Supplied in a Bag) (KDV Hariç)

7.711,68 TL

77,117 TL Each (Supplied in a Bag) KDV Dahil

Molex Micro-Fit 3.0 Series Vertical Through Hole PCB Header, 4 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded
Paketlenme türü seçiniz
sticker-359

6.426,40 TL

64,264 TL Each (Supplied in a Bag) (KDV Hariç)

7.711,68 TL

77,117 TL Each (Supplied in a Bag) KDV Dahil

Molex Micro-Fit 3.0 Series Vertical Through Hole PCB Header, 4 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded

Stok bilgileri geçici olarak kullanılamıyor.

Paketlenme türü seçiniz
sticker-359

Stok bilgileri geçici olarak kullanılamıyor.

MiktarBirim FiyatPer Bag
100 - 37064,264 TL321,32 TL
375 - 149561,596 TL307,98 TL
1500 - 299550,576 TL252,88 TL
3000+48,604 TL243,02 TL

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Teknik Belgeler

Özellikler

Marka

Molex

Seri

Micro-Fit 3.0

Hatve

3.0mm

Kontakların Sayısı

4

Sıraların Sayısı

2

Gövde Yönü

Dikey

Örtülü/Örtüsüz

Örtülü

Montaj Tipi

Açık Delik

Konnektör Sistemi

Kablo - PCB

Sonlandırma Yöntemi

Açık Delikli

Kontak Malzemesi

Pirinç

Kontak Kaplaması

Kalay

Akım Değeri

8.5A

Seri Numarası

43045

Gerilim Değeri

600 V

Ürün Ayrıntıları

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with PCB Polarizing Peg, 43045 Series

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more