Teknik Belgeler
Özellikler
Marka
MolexÜrün Tipi
PCB Başlığı
Seri
Micro-Fit 3.0
Akım
8.5A
Hatve
3mm
Kontakların Sayısı
10
Muhafaza Malzemesi
Termoplastik
Sıraların Sayısı
2
Yön
Dik Açı
Örtülü/Örtüsüz
Örtülü
Konnektör Sistemi
Tel - Kart
Montaj Tipi
Deliğe Takılan
Kontak Malzemesi
Pirinç
Kontak Kaplaması
Kalay
Sıra Aralığı
3mm
Sonlandırma Tipi
Lehim
Minimum Çalışma Sıcaklığı
-40°C
Maksimum Çalışma Sıcaklığı
105°C
Kontak Cinsiyeti
Erkek
Standartlar/Onaylar
No
Eşleştirme Pimi Uzunluğu
3mm
Gerilim
600 V
Distrelec Product Id
304-40-671
Ürün Ayrıntıları
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs
Molex Micro-Fit 3.0 Series
Stok bilgileri geçici olarak kullanılamıyor.
13.872,00 TL
138,72 TL Each (Supplied in a Box) (KDV Hariç)
16.646,40 TL
166,464 TL Each (Supplied in a Box) KDV Dahil
Üretime Uygun Paketleme (Kutu)
100

13.872,00 TL
138,72 TL Each (Supplied in a Box) (KDV Hariç)
16.646,40 TL
166,464 TL Each (Supplied in a Box) KDV Dahil
Stok bilgileri geçici olarak kullanılamıyor.
Üretime Uygun Paketleme (Kutu)
100

| Miktar | Birim Fiyat | Per Kutu |
|---|---|---|
| 100 - 370 | 138,72 TL | 693,60 TL |
| 375 - 1495 | 133,20 TL | 666,00 TL |
| 1500 - 2995 | 115,56 TL | 577,80 TL |
| 3000+ | 110,88 TL | 554,40 TL |
Teknik Belgeler
Özellikler
Marka
MolexÜrün Tipi
PCB Başlığı
Seri
Micro-Fit 3.0
Akım
8.5A
Hatve
3mm
Kontakların Sayısı
10
Muhafaza Malzemesi
Termoplastik
Sıraların Sayısı
2
Yön
Dik Açı
Örtülü/Örtüsüz
Örtülü
Konnektör Sistemi
Tel - Kart
Montaj Tipi
Deliğe Takılan
Kontak Malzemesi
Pirinç
Kontak Kaplaması
Kalay
Sıra Aralığı
3mm
Sonlandırma Tipi
Lehim
Minimum Çalışma Sıcaklığı
-40°C
Maksimum Çalışma Sıcaklığı
105°C
Kontak Cinsiyeti
Erkek
Standartlar/Onaylar
No
Eşleştirme Pimi Uzunluğu
3mm
Gerilim
600 V
Distrelec Product Id
304-40-671
Ürün Ayrıntıları
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs


