RS PRO PUR İzolasyon Döküm Reçinesi Kehribar Water Resistance
Teknik Belgeler
Özellikler
Marka
RS ProÜrün Malzemesi
PUR
Paket Tipi
Paket
Paket Boyutu
350 g
Diğer Özellikler
Su Direnci
Sertleşme Süresi
24 sa
Sertlik
60 Shore A
Termal İletkenlik
0.25W/mK
Renk
Kehribar
Maksimum Çalışma Sıcaklığı
+120°C
Minimum Çalışma Sıcaklığı
-50°C
Çalışma Sıcaklığı Aralığı
-50 → +120°C
Viskozite Ölçümü
550 mPa/s at +25°C
Fiziksel Form
Viskoz Sıvı
Koku
Küflü
Menşe
United Kingdom
Ürün Ayrıntıları
RS Pro Polyurethane Potting Compound
A flexible but tough potting compound which adheres to most surfaces.The material's low viscosity enables fine reproduction, good penetration and fast air removal before curing., Ideal for delicate electronic components requiring protection with flexibility and restraint.Vacuum degassing during cure will further reduce entrapped air. Handling represents minimal contact hazard.,Cure time: 24 hours @25°C; ,0.25 hours @100°C
Potting Compounds
The Potting Compounds are pourable two-part compounds for potting and encapsulating electronic circuits and components. They protect against moisture and corrosion and improve insulation resistance and mechanical strength. They may be cured at room temperature, or oven cured. Use silicone oil aerosol as a mould release agent. Full instructions supplied with each pack.
Stok bilgileri geçici olarak kullanılamıyor.
Ayrıntılı bilgi için iletşime geçiniz
P.O.A.
1
P.O.A.
1
Teknik Belgeler
Özellikler
Marka
RS ProÜrün Malzemesi
PUR
Paket Tipi
Paket
Paket Boyutu
350 g
Diğer Özellikler
Su Direnci
Sertleşme Süresi
24 sa
Sertlik
60 Shore A
Termal İletkenlik
0.25W/mK
Renk
Kehribar
Maksimum Çalışma Sıcaklığı
+120°C
Minimum Çalışma Sıcaklığı
-50°C
Çalışma Sıcaklığı Aralığı
-50 → +120°C
Viskozite Ölçümü
550 mPa/s at +25°C
Fiziksel Form
Viskoz Sıvı
Koku
Küflü
Menşe
United Kingdom
Ürün Ayrıntıları
RS Pro Polyurethane Potting Compound
A flexible but tough potting compound which adheres to most surfaces.The material's low viscosity enables fine reproduction, good penetration and fast air removal before curing., Ideal for delicate electronic components requiring protection with flexibility and restraint.Vacuum degassing during cure will further reduce entrapped air. Handling represents minimal contact hazard.,Cure time: 24 hours @25°C; ,0.25 hours @100°C
Potting Compounds
The Potting Compounds are pourable two-part compounds for potting and encapsulating electronic circuits and components. They protect against moisture and corrosion and improve insulation resistance and mechanical strength. They may be cured at room temperature, or oven cured. Use silicone oil aerosol as a mould release agent. Full instructions supplied with each pack.