Teknik Belgeler
Özellikler
Marka
TE ConnectivityUzunluk
41mm
Genişlik
16mm
Derinlik
0.04mm
Minimum Çalışma Sıcaklığı
0°C
Maksimum Çalışma Sıcaklığı
+70°C
Boyutlar
41 (mm) x 16 (mm) x 40 (μm)
Menşe
China
Ürün Ayrıntıları
TE Connectivity DT Series Piezoelectric Vibration Sensors
TE Connectivitys MEAS piezoelectric film sensors are constructed from silver ink screen printed electrodes on rectangular piezo film. Piezo vibration sensors without a lead can be adhered directly to a surface using epoxy resin or double sided tape, and leads can be attached with crimps, eyelets, conductive epoxy or compressive clamping. For the piezoelectric sensors that come with a lead, 28 AWG wire and a riveted lug are used.
Suitable applications include recording the time of an event, sensing dynamic strain, counting the number of impacts, measuring impact related events and making sensor elements.
Stok bilgileri geçici olarak kullanılamıyor.
51.086,40 TL
510,864 TL Each (In a Box of 100) (KDV Hariç)
61.303,68 TL
613,037 TL Each (In a Box of 100) KDV Dahil
100
51.086,40 TL
510,864 TL Each (In a Box of 100) (KDV Hariç)
61.303,68 TL
613,037 TL Each (In a Box of 100) KDV Dahil
Stok bilgileri geçici olarak kullanılamıyor.
100
Teknik Belgeler
Özellikler
Marka
TE ConnectivityUzunluk
41mm
Genişlik
16mm
Derinlik
0.04mm
Minimum Çalışma Sıcaklığı
0°C
Maksimum Çalışma Sıcaklığı
+70°C
Boyutlar
41 (mm) x 16 (mm) x 40 (μm)
Menşe
China
Ürün Ayrıntıları
TE Connectivity DT Series Piezoelectric Vibration Sensors
TE Connectivitys MEAS piezoelectric film sensors are constructed from silver ink screen printed electrodes on rectangular piezo film. Piezo vibration sensors without a lead can be adhered directly to a surface using epoxy resin or double sided tape, and leads can be attached with crimps, eyelets, conductive epoxy or compressive clamping. For the piezoelectric sensors that come with a lead, 28 AWG wire and a riveted lug are used.
Suitable applications include recording the time of an event, sensing dynamic strain, counting the number of impacts, measuring impact related events and making sensor elements.
