TE Connectivity Z-PACK HM Backplane Konnektör (PCB Kart Konnektörü), 4 Pinli, 2mm Aralıklı

RS Stok Numarası: 165-0770Marka: TE ConnectivityÜretici Parça Numarası: 120954-1
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Teknik Belgeler

Özellikler

Kontakların Sayısı

4

Sıraların Sayısı

1

Gövde Yönü

Dik Açı

Hatve

2mm

Kontak Malzemesi

Bakır Alaşım

Montaj Tipi

Açık Delik

Akım Değeri

16A

Sonlandırma Yöntemi

Baskılı Geçirme

Seri

Z-PACK HM

Menşe

United States

Ürün Ayrıntıları

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

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17.138,30 TL

451,008 TL Each (In a Tube of 38) (KDV Hariç)

20.565,96 TL

541,21 TL Each (In a Tube of 38) KDV Dahil

TE Connectivity Z-PACK HM Backplane Konnektör (PCB Kart Konnektörü), 4 Pinli, 2mm Aralıklı

17.138,30 TL

451,008 TL Each (In a Tube of 38) (KDV Hariç)

20.565,96 TL

541,21 TL Each (In a Tube of 38) KDV Dahil

TE Connectivity Z-PACK HM Backplane Konnektör (PCB Kart Konnektörü), 4 Pinli, 2mm Aralıklı

Stok bilgileri geçici olarak kullanılamıyor.

Stok bilgileri geçici olarak kullanılamıyor.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Teknik Belgeler

Özellikler

Kontakların Sayısı

4

Sıraların Sayısı

1

Gövde Yönü

Dik Açı

Hatve

2mm

Kontak Malzemesi

Bakır Alaşım

Montaj Tipi

Açık Delik

Akım Değeri

16A

Sonlandırma Yöntemi

Baskılı Geçirme

Seri

Z-PACK HM

Menşe

United States

Ürün Ayrıntıları

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more