TE Connectivity Z-PACK HM Series Straight Through Hole Mount PCB Socket, 3-Contact, Solder Termination

RS Stok Numarası: 718-1538Marka: TE ConnectivityÜretici Parça Numarası: 5-5223955-2
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Teknik Belgeler

Özellikler

Kontakların Sayısı

3

Tip

Kart - Kart

Montaj Tipi

Açık Delik

Gövde Yönü

Düz

Sonlandırma Yöntemi

Lehim

Akım Değeri

1.15A

Gerilim Değeri

250 V

Seri

Z-PACK HM

Kontak Malzemesi

Bakır

Menşe

United States

Ürün Ayrıntıları

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

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224,52 TL

224,52 TL Each (KDV Hariç)

269,42 TL

269,42 TL Each KDV Dahil

TE Connectivity Z-PACK HM Series Straight Through Hole Mount PCB Socket, 3-Contact, Solder Termination
Paketlenme türü seçiniz
sticker-359

224,52 TL

224,52 TL Each (KDV Hariç)

269,42 TL

269,42 TL Each KDV Dahil

TE Connectivity Z-PACK HM Series Straight Through Hole Mount PCB Socket, 3-Contact, Solder Termination

Stok bilgileri geçici olarak kullanılamıyor.

Paketlenme türü seçiniz
sticker-359

Stok bilgileri geçici olarak kullanılamıyor.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Teknik Belgeler

Özellikler

Kontakların Sayısı

3

Tip

Kart - Kart

Montaj Tipi

Açık Delik

Gövde Yönü

Düz

Sonlandırma Yöntemi

Lehim

Akım Değeri

1.15A

Gerilim Değeri

250 V

Seri

Z-PACK HM

Kontak Malzemesi

Bakır

Menşe

United States

Ürün Ayrıntıları

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more