RS PRO Thermal Interface Sheet, 0.5mm Thick, 3.5W/m·K, Fibreglass, 150 x 150mm

RS Stok Numarası: 915-6039Marka: RS PRO
brand-logo

Teknik Belgeler

Özellikler

Marka

RS Pro

Boyutlar

150 x 150mm

Kalınlık

0.5mm

Uzunluk

150mm

Genişlik

150mm

Termal İletkenlik

3.5W/m·K

Malzeme

Fiberglas

Minimum Çalışma Sıcaklığı

-55°C

Maksimum Çalışma Sıcaklığı

+200°C

Sertlik

Shore OO 20

Renk

Mavi

Çalışma Sıcaklığı Aralığı

-55 → +200°C

Menşe

Taiwan, Province Of China

Ürün Ayrıntıları

RS PRO Thermal Interface Silicone Gel Pads

RS PRO range of gel type silicone thermal pads which offer high performance and come in a multitude of thermal conductivity ratings and thicknesses. They are ultra-soft and have a natural tack making installation simple and suitable for a wide scope of applications.

Options available:
Silicone gel pad, glass 150x150 mm (glass filled for added performance)
915-6039 - 0.5 mm
915-6032 - 1.0 mm
915-6036 - 1.5 mm
915-6045 - 2.0 mm

Silicone gel pad, 4W/mK, 150x150 mm
915-6048 - 0.5 mm
915-6042 - 1.0 mm
915-6051 - 1.5 mm
915-6054 - 2.0 mm

Silicone gel pad, 6W/mK, 150x150 mm
915-6058 - 0.5 mm
915-6067 - 1.0 mm
915-6060 - 1.5 mm
915-6064 - 2.0 mm

Silicone gel pad, 8W/mK, 150x150 mm
915-6073 - 0.5 mm
915-6076 - 1.0 mm
915-6070 - 1.5 mm
915-6089 - 2.0 mm

Thermal gap pads provide a thermal interface between heatsinks (devices or substances for absorbing unwanted or excess heat) and electronic devices. They’re particularly useful where air gaps, rough surface textures or uneven surface topography prevent the use of traditional grease or paste.
Thermal gap pads are solid at room temperature, but as heat rises, they grow softer and can fill gaps. Often, devices are not entirely flush with the heatsink, and when the pad grows soft, it can spread and fill that gap.
RS PRO have a great range of products for the heating or cooling of electronic devices, components or enclosures to help devices maintain the right temperature to work effectively.

Stok bilgileri geçici olarak kullanılamıyor.

Ayrıntılı bilgi için iletşime geçiniz

Stok bilgileri geçici olarak kullanılamıyor.

Teklif İsteyiniz

RS PRO Thermal Interface Sheet, 0.5mm Thick, 3.5W/m·K, Fibreglass, 150 x 150mm

Teklif İsteyiniz

RS PRO Thermal Interface Sheet, 0.5mm Thick, 3.5W/m·K, Fibreglass, 150 x 150mm
Stok bilgileri geçici olarak kullanılamıyor.

Teknik Belgeler

Özellikler

Marka

RS Pro

Boyutlar

150 x 150mm

Kalınlık

0.5mm

Uzunluk

150mm

Genişlik

150mm

Termal İletkenlik

3.5W/m·K

Malzeme

Fiberglas

Minimum Çalışma Sıcaklığı

-55°C

Maksimum Çalışma Sıcaklığı

+200°C

Sertlik

Shore OO 20

Renk

Mavi

Çalışma Sıcaklığı Aralığı

-55 → +200°C

Menşe

Taiwan, Province Of China

Ürün Ayrıntıları

RS PRO Thermal Interface Silicone Gel Pads

RS PRO range of gel type silicone thermal pads which offer high performance and come in a multitude of thermal conductivity ratings and thicknesses. They are ultra-soft and have a natural tack making installation simple and suitable for a wide scope of applications.

Options available:
Silicone gel pad, glass 150x150 mm (glass filled for added performance)
915-6039 - 0.5 mm
915-6032 - 1.0 mm
915-6036 - 1.5 mm
915-6045 - 2.0 mm

Silicone gel pad, 4W/mK, 150x150 mm
915-6048 - 0.5 mm
915-6042 - 1.0 mm
915-6051 - 1.5 mm
915-6054 - 2.0 mm

Silicone gel pad, 6W/mK, 150x150 mm
915-6058 - 0.5 mm
915-6067 - 1.0 mm
915-6060 - 1.5 mm
915-6064 - 2.0 mm

Silicone gel pad, 8W/mK, 150x150 mm
915-6073 - 0.5 mm
915-6076 - 1.0 mm
915-6070 - 1.5 mm
915-6089 - 2.0 mm

Thermal gap pads provide a thermal interface between heatsinks (devices or substances for absorbing unwanted or excess heat) and electronic devices. They’re particularly useful where air gaps, rough surface textures or uneven surface topography prevent the use of traditional grease or paste.
Thermal gap pads are solid at room temperature, but as heat rises, they grow softer and can fill gaps. Often, devices are not entirely flush with the heatsink, and when the pad grows soft, it can spread and fill that gap.
RS PRO have a great range of products for the heating or cooling of electronic devices, components or enclosures to help devices maintain the right temperature to work effectively.