Chemtronics 3m Lehim Sökme Teli Örgülü, 2,8mm

Soder-Wick® De-soldering Braid

De-soldering braid packaged in static dissipative bobbins.

• Significantly reduces rework/repair time
• Minimises the risk of damage to the board
• Patented non-corrosive, halide free, organic no-clean flux
• BGA desolder braid is designed for removing solder from BGA pads and chips

Wick & Braid

Notes

Series 50 and Series 82 contain Rosin and Rosin SD