Teknik Belgeler
Özellikler
Marka
MolexÜrün Tipi
PCB Başlığı
Seri
Micro-Fit 3.0
Hatve
3mm
Akım
8.5A
Muhafaza Malzemesi
Termoplastik
Kontakların Sayısı
2
Sıraların Sayısı
2
Yön
Dik Açı
Örtülü/Örtüsüz
Örtülü
Konnektör Sistemi
Tel - Kart
Montaj Tipi
Deliğe Takılan
Kontak Kaplaması
Kalay
Kontak Malzemesi
Pirinç
Minimum Çalışma Sıcaklığı
-40°C
Sıra Aralığı
3mm
Sonlandırma Tipi
Lehim
Kontak Cinsiyeti
Dişi
Maksimum Çalışma Sıcaklığı
105°C
Eşleştirme Pimi Uzunluğu
3mm
Standartlar/Onaylar
No
Gerilim
250 V
Ürün Ayrıntıları
Say hello to streamlined circuits with this PCB header from Molex. It lets you make multiple wire-to-board connections onto a single block. A snap-in plastic peg lock and through-hole mounting make assembly a piece of cake while ensuring the header remains firmly in place during operation. As the unit's fully shrouded, the pins are protected from accidental damage, so will last the duration.
The header withstands up to 30 mating cycles. This means you can plug and unplug it from corresponding connectors multiple times without damaging it.
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals
Stok bilgileri geçici olarak kullanılamıyor.
Teklif İsteyiniz
Each (Supplied in a Bag) (KDV Hariç)
Üretime Uygun Paketleme (Bag)
5

Teklif İsteyiniz
Each (Supplied in a Bag) (KDV Hariç)
Stok bilgileri geçici olarak kullanılamıyor.
Üretime Uygun Paketleme (Bag)
5

Teknik Belgeler
Özellikler
Marka
MolexÜrün Tipi
PCB Başlığı
Seri
Micro-Fit 3.0
Hatve
3mm
Akım
8.5A
Muhafaza Malzemesi
Termoplastik
Kontakların Sayısı
2
Sıraların Sayısı
2
Yön
Dik Açı
Örtülü/Örtüsüz
Örtülü
Konnektör Sistemi
Tel - Kart
Montaj Tipi
Deliğe Takılan
Kontak Kaplaması
Kalay
Kontak Malzemesi
Pirinç
Minimum Çalışma Sıcaklığı
-40°C
Sıra Aralığı
3mm
Sonlandırma Tipi
Lehim
Kontak Cinsiyeti
Dişi
Maksimum Çalışma Sıcaklığı
105°C
Eşleştirme Pimi Uzunluğu
3mm
Standartlar/Onaylar
No
Gerilim
250 V
Ürün Ayrıntıları
Say hello to streamlined circuits with this PCB header from Molex. It lets you make multiple wire-to-board connections onto a single block. A snap-in plastic peg lock and through-hole mounting make assembly a piece of cake while ensuring the header remains firmly in place during operation. As the unit's fully shrouded, the pins are protected from accidental damage, so will last the duration.
The header withstands up to 30 mating cycles. This means you can plug and unplug it from corresponding connectors multiple times without damaging it.
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals