Multicore Lehim Pastası, 500g

MP218 No clean Tin-Lead solder paste

No clean solder paste with low wastage qualities.

• Halide free flux classification ROL0 to ANSI/J-STD-004
• Outstanding humidity resistance
• Colourless residue for easy post reflow inspection
• Extended open time & tack-life for low wastage
• Suitable for fine pitch, high speed printing up to 150mm/s
• Particle size 15-45μm
• Supplied in 500g tubs

Solder Paste - Leaded

Notes

Store in a cool place e.g. Refrigerator.

Standards

ROL0 to ANSI/J-STD-004

Supplied with

Material Satety Data Sheet.