
Teknik Belgeler
Özellikler
Marka
STMicroelectronicsÜrün Tipi
Sensör
Eksen Sayısı
6
Teknoloji
Gyroscope
Arabirim Tipi
SPI
Maksimum Frekans Yanıtı
20kHz
Minimum Frekans Yanıtı
1.6Hz
Minimum Besleme Gerilimi
1.71V
Paket Tipi
VFLGA
Maksimum Besleme Gerilimi
3.6V
Minimum Çalışma Sıcaklığı
-40°C
Maksimum Çalışma Sıcaklığı
105°C
Yükseklik
0.83mm
Uzunluk
2.5mm
Standartlar/Onaylar
RoHS, GREEN, ECOPACK
Genişlik
3 mm
Seri
ISM330DHCX
Besleme Akımı
1.5mA
Otomotiv Standardı
NO
Yanıt Süresi
35ms
Menşe
Malta
Ürün Ayrıntıları
The STMicroelectronics ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.;STs family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.;The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.;In the ISM330DHCX the sensing elements of the accelerometer and of the gyroscope are implemented on the same silicon die, thus guaranteeing superior stability and robustness.;The ISM330DHCX has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enable its usage in a broad range of applications.;All the design aspects and the calibration of the ISM330DHCX have been optimized to reach superior accuracy, stability, extremely low noise and full data synchronization.;An unmatched set of embedded features (Machine Learning Core, programmable FSM, FIFO, sensor hub, event decoding and interrupts) are enablers for implementing smart and complex sensor nodes which deliver high performance at very low power.;The ISM330DHCX is available in a 14-lead plastic land grid array (LGA) package.
Stok bilgileri geçici olarak kullanılamıyor.
2.489.520,00 TL
497,904 TL Each (On a Reel of 5000) (KDV Hariç)
2.987.424,00 TL
597,485 TL Each (On a Reel of 5000) KDV Dahil
5000
2.489.520,00 TL
497,904 TL Each (On a Reel of 5000) (KDV Hariç)
2.987.424,00 TL
597,485 TL Each (On a Reel of 5000) KDV Dahil
Stok bilgileri geçici olarak kullanılamıyor.
5000
Teknik Belgeler
Özellikler
Marka
STMicroelectronicsÜrün Tipi
Sensör
Eksen Sayısı
6
Teknoloji
Gyroscope
Arabirim Tipi
SPI
Maksimum Frekans Yanıtı
20kHz
Minimum Frekans Yanıtı
1.6Hz
Minimum Besleme Gerilimi
1.71V
Paket Tipi
VFLGA
Maksimum Besleme Gerilimi
3.6V
Minimum Çalışma Sıcaklığı
-40°C
Maksimum Çalışma Sıcaklığı
105°C
Yükseklik
0.83mm
Uzunluk
2.5mm
Standartlar/Onaylar
RoHS, GREEN, ECOPACK
Genişlik
3 mm
Seri
ISM330DHCX
Besleme Akımı
1.5mA
Otomotiv Standardı
NO
Yanıt Süresi
35ms
Menşe
Malta
Ürün Ayrıntıları
The STMicroelectronics ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.;STs family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.;The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.;In the ISM330DHCX the sensing elements of the accelerometer and of the gyroscope are implemented on the same silicon die, thus guaranteeing superior stability and robustness.;The ISM330DHCX has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enable its usage in a broad range of applications.;All the design aspects and the calibration of the ISM330DHCX have been optimized to reach superior accuracy, stability, extremely low noise and full data synchronization.;An unmatched set of embedded features (Machine Learning Core, programmable FSM, FIFO, sensor hub, event decoding and interrupts) are enablers for implementing smart and complex sensor nodes which deliver high performance at very low power.;The ISM330DHCX is available in a 14-lead plastic land grid array (LGA) package.